Specifications under development

Series 2 - CompactPCI Specifications

Series 3 - AdvancedTCA Specifications (AdvancedTCA™)

PICMG 3.1 R2.0 Ethernet/Fibre Channel for AdvancedTCA 

Project
Description 		The purpose of the Working Group is to develop enumberated requirements that incorporate 1000BASE-KX, 10GBASE-KX4, 10GBASE-KR and 49GBASE-KR4 fabric options into Revision 2.0 of the PICMG 3.1 specifications. A key goal of this activity is to guarantee backward compatibility with existing 3.x blade mechanicals and connectors, and interoperability with BX/BX4 fabric options.
Interim Chairman  Dough Sandy (Motorola)

PICMG ATCA300 Specification

Project
Description

This is a subsidiary specification to the PICMG 3.0 specification and will define the standard approach for implementing ATCA based equipment which requires compliance with 400mm ANSI and ETSI equipment practices. 

It will define board depth adjustment, front transition module usage models, front access power entry modules, cable management and thermal requirements. It may optionally include usage definitions for shelf controller base fabric implementations.
 Chairman  Nail Robinson (Optovia)

PICMG IRTM.0 ATCA IRTM Base Specification

Project
Description 		The objective of the AdvancedTCA Intelligent Rear Transition Module (IRTM) Base Specification is to define hardware platform management aspects of Intelligent (MMC-based) Rear Transition Module (IRTMs), covering Point-To-Point (P2P) and Clock E-Keying and related hardware platform management topics. 
Interim Chairman Jeff Marden (GE Fanuc Intelligent Platforms)

PICMG ATCA Extensions for Applications outside the Telecom Central Office

Project
Description

The objective is to develop extensions to the AdvancedTCA architecture to make the platform more optimal for non-telecom applications including network data centers. 

Goals are:

  • Maintain forward and backward compatibility with existing ATCA products
  • Enhanced features for double-wide Boards
  • Enhancements to power (and cooling)
  • Scalable environmentals
  • Allowances for double-sided Shelves
  • Optional support for 10Gbps signaling on Base Interface provided that backwards compatibility can be maintained
  • Add an additional example backplane topology

Deliverables will be either extensions to base PICMG 3.0 specification or supplemental specification early 2010.

Interim Chairman

Other Specifications 

PICMG MTCA.2 Conduction Cooled MicroTCA

Project
Description 		The intent is to create a conduction cooled module specification appropriate for commercial and military ruggedized applications for MicroTCA to include:

  • Commercial and Military Applications

  • Conduction cooled rugged form factors

  • Higher level of shock and vibration per ANSI/VITA 47 (vs. MTCA.1)

  • Military Airborne, Shipboard, and Ground Mobile Equipment (general requirements; not program-specific to avoid ITAR issues)

  • Outdoor Telecom

  • Machine Industry (Rotating machine mounted)

  • Transport Industry (Railway; truck; ship; aircraft mounted)
Chairman Michael R. Palis, Hybricon Corporation (interim)


PICMG MTCA.3 HardMicroTCA

Project
Description 		The intent is to expand the potential market space into commercial harden and ruggedized applications for MicroTCA to include:

  • Commercial/non-Military Application while maintaining hot swappable feature

  • Commercial solutions (forced air and/or conduction cooled/no fans)

  • Commercial solutions (higher level of shock and vibration as per IEC60721-3-3 Class 3M4 or 3M7)

  • Telco Industry Customer Premise Equipment

  • Machine Industry (Rotating machine mounted)

  • Transport Industry (Railway; truck; ship; aircraft mounted)

  • Traffic Control

  • Security
Chairman Mike Franco, Signal Stream Technologies (interim)

PICMG Physics xTCA Software Architectures & Protocols

Project
Description		 The intent is to define a common set of software architectures and supporting infrastructure that will facilitate inter-operability and portability of both hardware and software modules among the various applications developed for the Physics xTCA platform and that will minimize the development effort and time required to construct experiments and systems using that platform.

The working group shall strive for maximum compatibility with existing ATCA, µTCA and AMC specifications.
Interim Chair Stefan Simrock (DESY)

PICMG COM.0 R2.0

Project
Description		 The subcommittee is being formed to update the COM.0 specification to Revision 2. The work a.o. includes:
  • Incorporate Errata002

  • Evaluate how to add support for next generation (late 2009) video architectures including: displayPort, HDMI/DVI, Low voltage PCI Express Graphics (PEG) interface, De-multiplexing of PEG and SDVO, Support for multiple displays

  • Evaluate how to support PCI Express Gen2

  • Consider other new or evolving I/O interfaces (USB 3.0, SD Card)

It is expected that this subcommittee will submit the document for Membership Review summer  2009.
Chairman  Jeff Munch (Adlink)
Project
Description		 The subcommittee is being formed to update the COM.0 specification to Revision 2. It is expected that this subcommittee will submit the document for Membership Review by February 2009.
Chairman (interim) Jeff Munch (Adlink)

PICMG Interconnect Channel Characterization (SIC)

Project
Description		 This specification will establish standard nomenclatura, data formats and algorithms that can be used to specify and characterize the interconnect channel that are the basis of other PICMG architectural specifications. 

Various PICMG architectural specifications have electrical chapters that address the interconnect channel and define basic electrical requirements in terms of attenuation crosstalk and skew. It is now recognized that a more rigorous approach is needed to provide critical information that will allow potential adopters to evaluate the capability of an architecture for signaling at data rates beyond 3 Gigabits per second.
Chairman (interim) Michael Munroe (Elma Bustronic)